Packaging Technology for High Temperature Operation of Power Semiconductor Modules
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of The Japan Institute of Electronics Packaging
سال: 2014
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.17.464